III–V electronics & optoelectronics at IMEC
نویسندگان
چکیده
منابع مشابه
Recent Advances in 3D Integration at IMEC
IMEC is focusing its 3D-integration technology developments in 3 distinct directions: 3D-System-in-aPackage (3D-SiP), 3D-Wafer-Level-Packaging (3D-WLP) and 3D-Stacked-IC (3D-SiC). First, the background of these separate approaches will be given. Next the materials and technologies involved, the typical characteristics and the ongoing developments will be discussed. Finally, the roadmap for the ...
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ژورنال
عنوان ژورنال: III-Vs Review
سال: 1996
ISSN: 0961-1290
DOI: 10.1016/s0961-1290(96)80132-3